Following the release of the MediaTek Dimensity 9300 earlier this month, the world’s leading chip maker announced a new chipset, this time for sub-flagships and midrange devices.
And just like the top-of-the-line Dimensity 9300, the newly launched MediaTek Dimensity 8300 boasts support for on-device generative AI, alongside “low-power savings, adaptive gaming technology, and fast connectivity.” This new SoC is expected to compete directly with the Qualcomm Snapdragon 7 Gen 3, which debuted days ago.
The Dimensity 8300 is based on TSMC’s second-generation 4nm process node and boasts an octa-core design with four Cortex-A715 high-performance cores and four Cortex-A510 cores for basic tasks and day-to-day usage. According to MediaTek, the chip offers “20% faster CPU performance and 30% peak gains in power efficiency” compared to its predecessor, the Dimensity 8200.
MediaTek Dimensity 8300 product overview
The integrated six-core Mali-G615 GPU, meanwhile, is clocked at 1,400MHz and brings up to 60% faster graphics, plus the added bones of 55% power efficiency. In terms of memory, the Dimensity 8300 supports high-speed LPDDR5X RAM and UFS 4.0 storage tech, making it a great fit for sub-flagship phones and tablets — at least on paper.
MediaTek also says the onboard APU 780 AI processor uses the same architecture as the Dimensity 9300 and can run large language models or LLMs with up to 10 billion parameters natively, as well as stable diffusion. This will enable features like real-time language translation, text summarization, and even creative writing, as well as Stable Diffusion to generate images from prompts.
Devices powered by the MediaTek Dimensity 8300 are expected to go official on the global market by end-2023. The Redmi K70E is believed to be the first phone to use what is likely a variant of the 8300 series with a slightly higher configuration. Earlier today, the Xiaomi sub-brand confirmed that the Redmi K70E will launch with the Dimensity 8300-Ultra in China this November. It breached the 1.5-million mark in Antutu Benchmark with an overall score of 1,526,328.
Official ✅
— Abhishek Yadav (@yabhishekhd) November 21, 2023
Redmi K70E to launch with MediaTek Dimensity 8300 ultra processor.
AnTuTu benchmark score – 15,26,328
1.5 million #Redmi #RedmiK70E #Xiaomi pic.twitter.com/nZsSq1s6y3
And there’s a Dimensity 8300-Ultra, likely a variant of the 8300 series with a slightly higher configuration, which will power the Redmi K70E
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