Though there’s no official confirmation yet, the Xiaomi Mi 11 series — which will reportedly include at least the regular Mi 11 as well as the Mi 11 Pro — is rumored to launch later this month.
(Update, December 22: We have a launch date!)
The Chinese technology brand has already confirmed that its upcoming flagship lineup will be the first to use a Qualcomm Snapdragon 888 chipset, and now, a new leak seemingly confirms the Mi 11’s rear-facing camera design.
A third-party store in China has listed a couple of protective cases for the Xiaomi Mi 11 and Mi 11 Pro, suggesting the devices will feature different camera designs.
Alleged Xiaomi Mi 11 (top) and Xiaomi Mi 11 Pro cases (via ITHome)
The Mi 11 is shown to have three cameras and a flash unit in a square module reminiscent of that on Apple’s iPhone 12 series. It’s likely that the third camera is a macro or depth sensor for better portrait shots. Meanwhile, the Mi 11 Pro might adopt a horizontal layout with four cameras and a flash, with one of the cameras sporting a periscope telephoto lens to provide a longer — and more marketable — zoom range.
An earlier concept showing what the Xiaomi Mi 11 might look like based on leaks (via Ben Geskin on Twitter)
Both smartphones are said to come with a punch hole for the front camera, though the cases do not confirm this. A previous leak revealing a purported protective film for the Mi 11 suggests a quad-curved screen is on the way from Xiaomi. Another leak, this time showing an alleged high-resolution render of the Mi 11, hints at a sleek flagship with minimal bezels on the front.
A listing on China’s 3C certification website has also confirmed the inclusion of 55-watt fast charging on the base variant. Additionally, the Xiaomi Mi 11 is expected to ship with a 120Hz refresh rate.
小米11正式入网公示了，标配全新充电器，支持11V 5A最高55W快充，全球首发骁龙888[吃瓜] pic.twitter.com/LbXTRjziKv
— Digital Chat Station (@StationChat) December 8, 2020
China’s 3C certification website has confirmed the inclusion of 55-watt fast charging on the Xiaomi Mi 11
As for Qualcomm’s Snapdragon 888, the latest high-end chip is fabricated on a 5nm process and incorporates the Snapdragon X60 5G modem into its design. This makes the Snapdragon 888 the company’s first 5nm silicon with a built-in 5G baseband. The Snapdragon 888 packs Adreno 660 graphics as well. The latest GPU is claimed to offer up to 35% faster rendering performance and 20% better power efficiency than the Adreno 650 used in the Snapdragon 865 and Snapdragon 865 Plus.
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